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Title:
METHOD OF IMPROVING GROUND ON HIGHLY ADHESIVE COHESIVE SOIL LAYER
Document Type and Number:
Japanese Patent JP2010248770
Kind Code:
A
Abstract:

To provide a method of improving the ground on a highly adhesive cohesive soil layer by which method ground improvement is carried out not simultaneously but in two stages of natural ground cutting using an ultrahigh-pressure jet water and improvement material filling to ensure development of a planned improved body even if the soil to be improved is cohesive to show a highly adhesive soil quality.

The method of improving the ground on the highly adhesive cohesive soil layer includes a cutting process of jetting the ultrahigh-pressure jet water out of an ultrahigh-pressure jet nozzle to cut a natural soil of the highly adhesive cohesive soil layer, the cutting process accompanying a filling process of jetting an improvement material out of an improvement material jet nozzle onto a cut portion where the natural soil of the highly adhesive cohesive soil layer is cut to fill the improvement material in an improvement material development area. The cutting process and the filling process are executed as two stages of ground improvement.


Inventors:
NAKAGURO KENICHI
SHIMURA YOHEI
Application Number:
JP2009098590A
Publication Date:
November 04, 2010
Filing Date:
April 15, 2009
Export Citation:
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Assignee:
NAKAGURO KENSETSU KK
International Classes:
E02D3/12; E02D3/00
Domestic Patent References:
JPH0641944A1994-02-15
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tadashi Masui