Title:
METHOD FOR INCREASING COATING RATE, METHOD FOR DECREASING DUST DENSITY IN PLASMA DISCHARGE SPACE AND PLASMA CHAMBER
Document Type and Number:
Japanese Patent JP3683599
Kind Code:
B2
Abstract:
PURPOSE: To increase the coating rate of a plasma enhanced vacuum coating process and to improve the quality of a surface to be processed.
CONSTITUTION: In order to increase the processing rate in the plasma enhanced chemical evaporation sepn. process in vacuum no matter whether the rate is the coating rate or etching rate, the layer stress by the ion shooting is simultaneously decreased in the case of the former, by which the prescribed dust density distributed along the processing surface 62 is formed and maintained within the plasma process space. The distribution of the dust particles captured within the plasma PL is controlled by the generation of the field Wρ of force.
More Like This:
| JPS61218811 | MINUTE PARTICLE FLOW CONTROL APPARATUS |
| JPH09241845 | ELECTRODE FILM FORMING DEVICE |
| JPS5814539 | FORMATION OF THIN FILM |
Inventors:
Jack schmidt
Paul-Rene Mural
Paul-Rene Mural
Application Number:
JP9437594A
Publication Date:
August 17, 2005
Filing Date:
May 06, 1994
Export Citation:
Assignee:
Unaxis Balzers Akchen Gesell Shaft
International Classes:
C23C14/54; B65G49/07; C23C16/44; C23C16/50; C23C16/52; C23C16/54; C23F4/00; H01L21/205; H05H1/46; (IPC1-7): C23C16/52; C23C14/54; C23F4/00
Domestic Patent References:
| JP6124902A |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Masaya Nishiyama
Higuchi Souji
Previous Patent: PLASTIC MOLDED SEMICONDUCTOR DEVICE
Next Patent: METHOD AND DEVICE FOR COATING OBJECT ROTATING ABOUT AXIS
Next Patent: METHOD AND DEVICE FOR COATING OBJECT ROTATING ABOUT AXIS