To provide a method for manufacturing an electronic component, in which an external electrode having a region in which a conductive resin of a second electrode layer (buffer layer) does not exist on a central part of the end face of an insulating material can be formed with proper productivity and at a low cost.

The method for manufacturing the electronic component comprises steps of pushing the end face 2a of a laminate 2 against a metal base 41 before a conductive resin 42 adhered to the laminate 2 is dried. Since the first electrode layer 4a is made to swell in a protrusion state, a resin 42 coating a part 24 of the end face 2a of the laminate 2 is transferred to a base 21 in a relatively large amount.