To obtain a method of manufacturing an insulation material, whereby an integrated insulation material having a dielectric constant inclining so that the dielectric constant is lowered from a portion making contact with a high voltage applied conductor of a high voltage apparatus toward its grounding side is materialized with a small number of processes.
An inorganic filled filling resin made by mixing a first inorganic filler with a particle diameter of 4 μm or more and a second inorganic filler having a larger dielectric constant than that of the first inorganic filler with a particle diameter of 1 μm with a liquid thermosetting resin is obtained. This inorganic filler filled resin is injected in a die, the die wherein the inorganic filler filled resin is injected rotates with an center axis passing through the center of the die and extending in the thickness direction of the die as a rotation axis, the inorganic filler filled resin is loaded with centrifugal force applied from its center part to the outside, and the inorganic filler filled resin loaded with the centrifugal force is hardened to obtain this insulating material.
KATO KATSUMI
KURIMOTO MUNEAKI
ADACHI HIROSHI
ITO HIROMI
Yahei Takase
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