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Title:
METHOD OF PRODUCING MULTILAYER SUBSTRATE, AND MULTILAYER SUBSTRATE
Document Type and Number:
Japanese Patent JP2005019474
Kind Code:
A
Abstract:

To provide a method of producing a multilayer substrate in which positional shift of a conductor pattern accompanying the flowing of a resin in the plane direction can be reduced, and to provide a multilayer substrate being formed by that method.

A laminate 10 of a plurality of a single side conductor pattern films 1 is heated and pressed and bonded to a resin film 2 thus forming a multilayer substrate 20. In the hot press process, a second cushion member 50 of a specified thickness exhibiting cushion effect is interposed between the peripheral part 11 of the laminate 10 and a hot press plate 30. The peripheral part 11 is pressed earlier than the central part 12 and compressed with a higher pressure as compared with the central part 12. Consequently, the flow of softened resin in the direction from the central part 12 to the peripheral part 11 can be controlled and positional shift of the conductor pattern 3 can be reduced.


Inventors:
HARADA TOSHIICHI
SHIN KEIICHI
MORI TAKAYUKI
Application Number:
JP2003178603A
Publication Date:
January 20, 2005
Filing Date:
June 23, 2003
Export Citation:
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Assignee:
DENSO CORP
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Kazuyuki Yahagi