To reduce time required for a process by easily obtaining the optimum conditions of a die bonding apparatus.
The method for regulating the apparatus for manufacturing the semiconductor device comprises the steps of automatically regulating a servo motor for moving an object to be processed such as a lead frame or the like from a point A to a point B according to a flow. The flow has the steps of obtaining the highest acceleration of the motor from the load inertial of the motor, further automatically setting the various type parameters of the motor and the levels of the parameters in response to a mechanical rigidity (resonance frequency), forming an orthogonal table and a cause effect diagram, and automatically extracting the parameters and the levels so that an SN ratio becomes high. As a result, the optimum conditions of the apparatus can be obtained by the simple flow, the object to be processed such as the lead frame or the like can be rapidly and surely operated, and the processing time of the process such as fixing (die bonding) of the semiconductor chip on the lead frame can be reduced.
HIGUCHI KAZUNORI
SUDA TOMIJI
HITACHI TOKYO ELECTRONICS
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