METHOD OF REMOVING EDGE PORTION OF LAYER APPLIED TO SUBSTRATE AND DEVICE, METHOD OF COATING SUBSTRATE AND DEVICE, AND SUBSTRATE

Title:

METHOD OF REMOVING EDGE PORTION OF LAYER APPLIED TO SUBSTRATE AND DEVICE, METHOD OF COATING SUBSTRATE AND DEVICE, AND SUBSTRATE

Document Type and Number:

Japanese Patent JP2004327973

Kind Code:

A

Abstract:

To provide a method of removing edge portion of a layer treated on a substrate used in a micro lithography processing treatment.

The edge portion is removed in evaporation by a laser beam in such a way that the laser beam is focused on the edge portion of a treating layer.

Inventors:

WAGNER HERMANN
BEIER BERND
SCHIFFLER MARIO
HESS GUENTER
RUDAKOFF PETER
HOETZEL BERND

Application Number:

JP2004106382A

Publication Date:

November 18, 2004

Filing Date:

March 31, 2004

Export Citation:

Assignee:

SCHOTT GLAS

International Classes:

B23K26/40; G03F7/20; H01L21/027; (IPC1-7): H01L21/027; G03F7/20

Attorney, Agent or Firm:

Tadashi Hamamoto
Yoshiaki Sato

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