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Patent Searching and Data


Title:
METHOD AND SYSTEM FOR MOUNTING MICRO METALLIC BALL
Document Type and Number:
Japanese Patent JP2002151536
Kind Code:
A
Abstract:

To provide a method for mounting micro metallic balls on a mounting surface using a suction head in which the micro metallic balls can be mounted while spacing the suction head significantly from the mounting surface.

A suction head 11 has a vibration generator 14 including an ultrasonic vibrator. When a micro metallic ball 10 is mounted on an electrode pad 16, the electrode pad 16 is coated with flux at first and then the micro metallic ball 10 is carried above the electrode pad 16 by means of the suction head 11. After releasing vacuum suction through the suction head 11, the vibration generator 14 is actuated to apply ultrasonic vibration to the metallic ball 10. Since the trend of the metallic ball 10 to separate from the suction hole 12 in the suction head 11 is enhanced, the metallic ball 10 separates in substantially natural state, i.e., a state of zero initial speed, from the suction head 11 and drops vertically downward.


Inventors:
SHIGEMURA TOSHIO
Application Number:
JP2000342228A
Publication Date:
May 24, 2002
Filing Date:
November 09, 2000
Export Citation:
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Assignee:
UENO SEIKI KK
International Classes:
B25J15/06; B23K3/06; H01L21/60; H05K3/34; (IPC1-7): H01L21/60; B23K3/06; B25J15/06; H05K3/34
Attorney, Agent or Firm:
Toshiaki Ikeura