コバルト及び／又はコバルト合金含有基板を研磨するための化学機械研磨（ＣＭＰ）組成物を使用する方法

Title:

コバルト及び／又はコバルト合金含有基板を研磨するための化学機械研磨（ＣＭＰ）組成物を使用する方法

Document Type and Number:

Japanese Patent JP7294809

Kind Code:

B2

Abstract:

Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a poly(amino acid) and or a salt thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.

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Inventors:

Michael Lauter
Guevenk, Hachi Ottoman
Giebert, Max
Orchid, yonchin
Usman Ibrahim, Sheikh Ansar
Golsarian, Reza M
Way, To Yui

Application Number:

JP2018550450A

Publication Date:

June 20, 2023

Filing Date:

March 13, 2017

Export Citation:

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Assignee:

BASF SE

International Classes:

H01L21/304; B24B37/00; C09G1/02; C09K3/14

Domestic Patent References:

JP201460205A
JP2009231298A
JP2012182158A
JP201630831A

Foreign References:

WO2014132641A1

Attorney, Agent or Firm:

Toshiaki Eto
Akiko Kurawaki
Osamu Yamaguchi
Kenji Inagaki
Hironori Nagayama

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