To provide a module circuit unit that allows space-saving connection of module circuits on a base substrate and higher density mounting.

The module circuit unit comprises a plurality of module circuits disposed on the base substrate. The plurality of module circuits are disposed to contact each other at the sides thereof with recesses being formed on the sides thereof. A connection terminal is embedded into a hole that is formed by combining recesses on the mutually adjacent sides, and the sides of the adjacent module circuits are directly wire-connected.