Title:
MULTI-CHIP WITH OPTICAL COUPLING MEANS
Document Type and Number:
Japanese Patent JP2009117810
Kind Code:
A
Abstract:
To provide a multi-chip with optical coupling means.
Two or more silicon chips 210, 230 laminated in parallel, two or more optical element arrays 220, 240, which are bonded opposite to each other, respectively, on the side face of each silicon chip and are equipped with a light emitting element and/or a light receiving element, respectively, and wires 228, 238, which connect the silicon chip and the optical element array mounted on the side face of the silicon chip, are provided. The optical element array is a multi-chip for transceiving an optical signal between the corresponding optical elements in different layers formed in multi-layer.
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Inventors:
CHO SOO-HAENG
HA KYOUNG-HO
RYU HAN-YOUL
SUH SUNG-DONG
KIM SEONG-GU
MIN BOK-KI
HA KYOUNG-HO
RYU HAN-YOUL
SUH SUNG-DONG
KIM SEONG-GU
MIN BOK-KI
Application Number:
JP2008257739A
Publication Date:
May 28, 2009
Filing Date:
October 02, 2008
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01S5/022; H01L25/16; H01S5/183
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro