Title:
MULTILAYER BOARD AND ELECTRONIC DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2014220308
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enhance heat dissipation compared with a case where a through via is formed in a core layer, the through via being perpendicular to the surface of the core layer.SOLUTION: Out of a plurality of through vias 80 provided in a core layer 20, at least two through vias 82, 83 located below a land 61 are tilted away from each other, from the front surface 20a toward the back surface 20b of the core layer 20. When heat is transferred in the core layer 20 from the electronic component 121 side to the opposite side thereof, the heat can thereby be diffused to spread outward along the two through vias 82, 83. Consequently, transfer of heat in the core layer 20 can be promoted compared with a case where the through vias 80 are perpendicular to the front surface 20a of the core layer 20, resulting in the enhancement of heat dissipation of a multilayer board 10.
Inventors:
NAKAMURA TOSHIHIRO
TATSUMI MASAHIDE
YABUTA EIJI
TATSUMI MASAHIDE
YABUTA EIJI
Application Number:
JP2013097230A
Publication Date:
November 20, 2014
Filing Date:
May 06, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/12; H05K1/02; H05K3/46
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm