Title:
MULTILAYERED HEAT-SENSITIVE ADHESION FILM AND MULTILAYERED STRUCTURAL MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP3501870
Kind Code:
B2
Abstract:
PURPOSE: To obtain a multilayered structural material of a multilayered heat- sensitive adhesive film having excellent adhesive property, air blocking property and heat resistance suitable as an interior of an automobile, a vehicle and a ship, etc.
CONSTITUTION: The objective multilayered heat-resistant and heat-sensitive adhesion film has a three-layered structure comprising both outer layers of a heat-sensitive adhesive composition composed of (a) an ethylenic copolymer containing 0.1-5wt.% of a unit derived from a radically polymerizable acid anhydride and ≤10-50wt.% of a unit derived from a radically polymerizable comonomer other than the radically polymerizable acid anhydride, (b) a polyhydric alcohol compound having more than two hydroxyl groups in a molecule, (c) a reaction accelerator and (d) a tackiness imparting agent and an intermediate layer comprising a polyolefinic resin having ≥100°C melting point. The multilayered structural material is obtained by adhering a skin material to a base material using the multilayered heat-sensitive adhesion film.
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Inventors:
Yukio Okamoto
Koji Nagaoka
Hirotaka Tagoshi
Koji Nagaoka
Hirotaka Tagoshi
Application Number:
JP10422895A
Publication Date:
March 02, 2004
Filing Date:
April 27, 1995
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
B32B7/12; B32B27/32; C09J7/02; C09J123/02; C09J123/08; (IPC1-7): C09J7/02; B32B7/12; B32B27/32
Domestic Patent References:
JP679817A | ||||
JP781008A |
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)