Title:
MULTISTORY BASE INSULATION BUILDING
Document Type and Number:
Japanese Patent JP2022161982
Kind Code:
A
Abstract:
To provide a multistory base isolation building capable of effectively coping with a small and medium scale earthquake vibration of high occurrence frequency to an excessive earthquake vibration exceeding a normal design level.SOLUTION: A multilayer base isolation building 1A, which is one 1A provided with a plurality of base isolation layers 4, is configured by connecting a lower structure 2, a lower base isolation layer 40, an intermediate structure 31, an intermediate base isolation layer 50, and an upper structure 32 from the lower side to the upper side. Either one base isolation layer 40 of the lower base isolation layer 40 and the intermediate base isolation layer 50 has a horizontal rigidity set smaller than that of the other base isolation layer 50 and is provided with a rigidity imparting mechanism 43 for increasing the horizontal rigidity of the one base isolation layer 40 in accordance with a deformation of the one base isolation layer 40, and the other base isolation layer 50 is deformed in a state where the horizontal rigidity of the one base isolation layer 40 is increased by the rigidity imparting mechanism 43 when an earthquake occurs.SELECTED DRAWING: Figure 1
Inventors:
Sho Aono
Baruki Ryudai
Baruki Ryudai
Application Number:
JP2022129140A
Publication Date:
October 21, 2022
Filing Date:
August 15, 2022
Export Citation:
Assignee:
Taisei Corporation
International Classes:
E04H9/02; F16F7/00; F16F15/02
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation