Title:
ETCHING APPARATUS OF SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPH0729874
Kind Code:
A
Abstract:
PURPOSE: To prevent parts other than a semiconductor substrate from being etched when the semiconductor substrate is etched by RF and to prevent etched parts as dust particles from adhering to the surface of the substrate.
CONSTITUTION: Parts, other than a semiconductor substrate, which have been etched in conventional cases are changed into a metal upper-part electrode cover 3, a metal counter-electrode cover 4 and a metal wafer retainer 6. The covers and the retainer are connected to a ground, and an electric charge which is stored can be made to escape. Thereby, it is possible to prevent parts other than the semiconductor substrate from being etched. As a result, it is possible to restrain dust particles from being generated.
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Inventors:
YOSHIOKA SHINYA
Application Number:
JP15501993A
Publication Date:
January 31, 1995
Filing Date:
June 25, 1993
Export Citation:
Assignee:
HIROSHIMA NIPPON DENKI KK
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/3065
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: PREPARATION OF SEMICONDUCTOR DEVICE