Title:
【発明の名称】プローブカード及びその製造方法
Document Type and Number:
Japanese Patent JP3066784
Kind Code:
B2
Abstract:
A probe card assembly thermal influenced from a wafer with which a probe makes contact during a probe test. The assembly includes a probe card unit having a great number of probes to be brought into contact with the wafer to be tested, and a holder for holding the probe card unit at a center portion thereof. The holder includes a ring member, supported by another member, for supporting the probe card unit from a low side, and a cutout stepped member and a slot hole for relaxing stress due to thermal expansion concentrated on the ring member.
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Inventors:
Hidetoshi Kimura
Tetsuya Utsunomiya
Tomoaki Mochizuki
Tetsuya Utsunomiya
Tomoaki Mochizuki
Application Number:
JP35407092A
Publication Date:
July 17, 2000
Filing Date:
December 14, 1992
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01R1/073; H01L21/66; G01R1/067; G01R31/28; (IPC1-7): G01R1/073; H01L21/66
Domestic Patent References:
| JP2156161A |
Attorney, Agent or Firm:
Toshio Inoue