PURPOSE: To provide a multilayered thin-film printed-circuit board capable of reliable connection by forming I/O terminals, each having a non-buffering composite structure of different metal layers and being isolated electrically from the substrate surface.

CONSTITUTION: A first interconnection layer 2a, and underlays 3a for I/O terminals 3 are provided on the surface of an insulating substrate 1. The layers 2a and 3a each include a refractory metal layer and an aluminum layer. The entire surface of the substrate, except part of the surface of the individual underlays, is covered with an insulating layer 2d. A protective layer is formed around the inner insulating layer 2d and the underlays 3a, and interconnection layers 2b and 2c and another inner insulating layer 2d are formed to provide a multilayered thin-film interconnection 2. The interconnection layers 2b and 2c are extended to connect the underlay 3a, and a contact layer 3c for an I/O terminal 3 is provided. The uppermost interconnection layer 2c is then covered with a protective insulating layer 2d'. In this manner a reliable, multilayered thin-film printed circuit board is obtained.