Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2020118948
Kind Code:
A
Abstract:
To provide a negative photosensitive resin composition capable of forming a pattern having excellent resolution when a photolithography method is applied, a resin film that is a cured product of the same, and an electronic device comprising the resin film.SOLUTION: The negative photosensitive resin composition is provided that includes a cresol novolac type epoxy resin, and a photoacid generator.SELECTED DRAWING: None
Inventors:
MITSUI YASUAKI
TAKAHASHI YASUNORI
TAKAHASHI YASUNORI
Application Number:
JP2019100937A
Publication Date:
August 06, 2020
Filing Date:
May 30, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/038; C08G59/40; C08L45/00; C08L63/04; G03F7/004
Attorney, Agent or Firm:
Shinji Hayami