NEW COMPOUND, ADDITIVE FOR ELECTROLYTIC COPPER PLATING COMPRISING THE COMPOUND, ELECTROLYTIC COPPER PLATING BATH CONTAINING THE ADDITIVE, AND ELECTROLYTIC COPPER PLATING METHOD USING THE PLATING BATH

Title:

NEW COMPOUND, ADDITIVE FOR ELECTROLYTIC COPPER PLATING COMPRISING THE COMPOUND, ELECTROLYTIC COPPER PLATING BATH CONTAINING THE ADDITIVE, AND ELECTROLYTIC COPPER PLATING METHOD USING THE PLATING BATH

Document Type and Number:

Japanese Patent JP2007016264

Kind Code:

A

Abstract:

To provide an additive for electrolytic copper plating, which is hardly degraded after an electrolytic bath has been made up, and with which copper can be adequately embedded in a fine groove and hole; an electrolytic copper plating bath using the same; and an electrolytic copper plating method.

A compound, used as the additive, is expressed by general formula (1) (wherein, R1 and R2 are each hydrogen or an aromatic group expressed by general formula (2); M is an alkali metal, ammonium or monovalent organic ammonium; A is a benzene ring or naphthalene ring; and R3 is an alkyl group, halogen group or alkoxy group).

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Inventors:

SHIBATA TOSHIHIRO
SASAKI ASAKO

Application Number:

JP2005197384A

Publication Date:

January 25, 2007

Filing Date:

July 06, 2005

Export Citation:

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Assignee:

ADEKA CORP

International Classes:

C25D3/38

Attorney, Agent or Firm:

Michiteru Soga
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku

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