Ni-BASED HIGH TEMPERATURE STRENGTH MEMBER AND METHOD FOR PRODUCING THE SAME

Japanese Patent JP3779228

B2

PROBLEM TO BE SOLVED: To provide a technology capable of solving the problem that, when a Ni-based single crystal alloy or a Ni-based uniaxially solidified alloy is subjected to plastic working strain, the effected part is recrystallized by heating at a high temperature and the high temperature strength is lowered. SOLUTION: An Ni-B alloy plated film is formed on the surface of the Ni- based single crystal alloy or the Ni-based uniaxially solidified alloy by an electroless plating method, or the like. Thereby, boron diffuses and permeates to the recrystallization part under a high temperature environment and the bonding force at the grain boundaries is enhanced, and further, lowering in strength of an alloy base material is prevented. Furthermore, a high temperature strength member having a double layer structure prepared by forming a heat resistant alloy coated layer on a Ni-B alloy-plated film (undercoat) and resistance to high temperature environment and a high temperature strength member having a three layer structure prepared by further forming a coated layer of a ZrO2-based ceramic containing an oxide and resistance to high temperature environment are provided, and the methods for producing these members are also provided.