To provide an optical element package with high airtightness and an optical element mounting substrate realizing the optical element package.
A second substrate 2 is arranged on a first substrate 1 having solder 6 connecting an optical element so that the solder 6 is surrounded. The first substrate 1 and the second substrate 2 are formed of ceramic. A first conductor layer 3 is formed on the first substrate 1 and a second conductor layer 5 is formed at a rear face of the first substrate 1. The first conductor layer 3 and the second conductor layer 5 are conducted, and the solder 6 is formed on the first conductor layer 3. A third conductor layer 9 which can be bonded to a glass 4 is laminated and formed with the first conductor layer 3. The first substrate 1 and the second substrate 2 are bonded by the glass 4 via the third conductor layer 9. Since the first substrate 1 and the second substrate 2 are bonded by the glass 4, infiltration of a moisture content from an interface is inhibited.
TAKEMORI HIDEAKI
HIGASHIYAMA MASASHI
