Title:
ORGANIC PLATING METHOD AND ORGANIC PLATED PRODUCT
Document Type and Number:
Japanese Patent JP3690975
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a film having a controlled surface structure by accelerating a film forming speed when organic plating is applied on a metallic surface by using an electrolytic solution containing a triazine thiol derivative.
SOLUTION: A solution obtained by mixing one or more kinds of triazine thiol derivatives shown in figure 1 is used as an electrolytic solution, and a metallic surface is electrochemically treated in the magnetic environment of 2,000 G (0.2 T) to 10 T, so that organic plating is performed thereto.
Inventors:
Kunio Mori
Application Number:
JP2000309542A
Publication Date:
August 31, 2005
Filing Date:
October 10, 2000
Export Citation:
Assignee:
Japan Science and Technology Agency
International Classes:
C25D5/00; C25D9/02; C25D21/12; (IPC1-7): C25D9/02; C25D21/12
Domestic Patent References:
| JP2000160392A | ||||
| JP11071357A |
Attorney, Agent or Firm:
Yusaku Maruoka
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