Title:
PACKAGE FOR PRESSURE DETECTING DEVICE
Document Type and Number:
Japanese Patent JP2002005766
Kind Code:
A
Abstract:
To provide a small-sized and high-sensitivity pressure detecting device.
An electrostatic capacity forming electrode 7 is provided on one principal plane of an insulated substrate 1 mounted with a semiconductor element 3 on the other principal plane, and an electrostatic capacity forming metal plate 2 facing the electrode 7 is connected in a flexible state to form a closed space between it and the insulated substrate 1 in this package for a pressure detecting device.
Inventors:
FURUMOTO YUICHI
TOKI HIROSHI
TOKI HIROSHI
Application Number:
JP2000191236A
Publication Date:
January 09, 2002
Filing Date:
June 26, 2000
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
G01L9/12; G01L9/00; H01L23/28; H01L29/84; (IPC1-7): G01L9/12; H01L23/28; H01L29/84
Previous Patent: SEMICONDUCTOR PRESSURE SENSOR AND ITS MANUFACTURING METHOD
Next Patent: PRESSURE DETECTING DEVICE AND ITS FITTING STRUCTURE
Next Patent: PRESSURE DETECTING DEVICE AND ITS FITTING STRUCTURE