Title:
PACKAGE FOR SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014203888
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a package for semiconductor device in which burrs on the back of a lead electrode are prevented, and to provide a manufacturing method therefor.SOLUTION: A package 2 for light-emitting device in which lead electrodes 10, 20 are integrated with a resin molding 3. The long plate part 12 of the lead electrode 10 is exposed to the back of the package 2 for light-emitting device, and the side plate parts 13, 13 are embedded in the resin molding 3. The side plate parts 13, 13, before being used for molding, are inclining for the long plate part 12. While pinching the side plate part 13 by the protrusion 53 of a lower mold 51 and an upper mold 52, and pressing the long plate part 12 against the lower mold 51, resin is injected into a cavity 60 to produce the resin molding 3.
Inventors:
UMEDA KAZUNORI
MATSUI JUN
KATO YUKIO
MATSUI JUN
KATO YUKIO
Application Number:
JP2013076972A
Publication Date:
October 27, 2014
Filing Date:
April 02, 2013
Export Citation:
Assignee:
MITSUBISHI PLASTICS INC
International Classes:
H01L23/28; B29C33/14; B29C45/14; H01L21/56; H01L33/48; H01L33/62
Attorney, Agent or Firm:
Takeshi Shigeno
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