To provide a package for storing a semiconductor element wherein the short-circuiting between its wiring conductors can be sensed easily.

The package for storing a semiconductor element comprises an insulating substrate 1 having a plurality of laminated insulating layers on whose top surface a mounting portion 1b for mounting thereon a semiconductor element 5 is formed. Also, a pair of signal-oriented wiring conductors 4 are formed in a single interface between the insulating layers of the insulating substrate 1. Further, the signal-oriented wiring conductors 4 each keep one end and the other end derived to the top surface of the insulating substrate 1, so that the other ends are connected by respective connective conductors 3 formed on the top surface. Moreover, another wiring conductor 2 is so formed in the foregoing single interface between the insulating layers of the insulating substrate 1 as to be interposed between the wiring conductors 4, and an end of the wiring conductor 2 is derived to the top surface of the insulating substrate 1.