To provide a photodetector in which a CCD reading section can be cooled efficiently while reducing the overall size, and to provide its manufacturing process.
A semiconductor substrate 4 where a light incident to the rear surface is detected at a charge reading section 4a comprising a charge coupling element formed on the surface side is secured to the bottom part 2a of a package 2 through a means 5 for cooling the charge reading section 4a. The rear surface is made thin at a part corresponding to a region 4b where the charge reading section 4a is formed, and the cooling means 5 touches the surface while covering the region 4b where the charge reading section 4a is formed. The cooling means 5 has planar dimensions larger than those of the region 4b where the charge reading section 4a is formed but smaller than those of the surface. An electrode pad 4c provided on the periphery of a surface region covered with the cooling means 5 is connected with a package terminal 2d provided in the package 2 through a bonding wire 6.
MURAMATSU MASAHARU
Tatsuya Shioda
Shiro Terasaki