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Title:
感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5093229
Kind Code:
B2
Abstract:
The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.

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Inventors:
Mitsukura
Takashi Kawamori
Takashi Masuko
Katogi Shigeki
Application Number:
JP2009509055A
Publication Date:
December 12, 2012
Filing Date:
March 19, 2008
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J179/08; C09J4/06; C09J7/02; C09J11/06; C09J163/02; H01L21/52
Domestic Patent References:
JP2005316449A2005-11-10
JPH089643B21996-01-31
JP2006330301A2006-12-07
JP2006124531A2006-05-18
JP2006023419A2006-01-26
Foreign References:
WO2007004569A12007-01-11
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu



 
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