To provide a photosensitive adhesive resin composition having good developability to be used as a spacer for a substrate on which a transparent substrate and a semiconductor element are mounted, an adhesive film using the same, and a light-receiving device.

A photosensitive adhesive resin composition characterized by containing a compound (A) having a hydroxy group or a carboxy group and a (meth)acryloyl group, a compound (B) thermosettingly reactive with the compound (A) having a hydroxy group or a carboxy group and the (meth)acryloyl group, a compound (C) having a (meth)acryloyl group but not having a hydroxy group and a carboxy group, a phenol resin or phenol (D), and a sensitizer (E). The photosensitive adhesive resin composition is provided to achieve the objects described above.