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Title:
PHOTOSENSITIVE AROMATIC POLYAMIDE RESIN, ITS COMPOSITION AND SHEET MADE FROM THIS COMPOSITION
Document Type and Number:
Japanese Patent JP3416018
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a photosensitive aromatic polyamide resin which is easily producible, has excellent heat resistance and solvent solubility and high processability and undergoes easily a photocrosslinking reaction by selecting a resin comprising repeating units each having a phenolic-hydroxyl-containing aromatic dicarboxylic acid and an alkyl-substituted diphenylmethane type aromatic diamine.
SOLUTION: This resin is one containing at least 50 mol% repeating units represented by formula I (wherein R1 and R2 are each H, a 1-4C alkyl or an alkoxyl; Z is a photosensitive group of formula II; R3 is H, CN or -CH3; R4 is H, a 10C or lower aliphatic group, phenyl furyl or benzyl; X is -CH2-, -C(CH3)2-, -C(CF3)2-, -SO2-, -S-or-CO-; and m/(m+n), which is the rate of the photosensitive groups introduced, is in the range of 0.01-1.0. The resin is mixed with 0.2-15 pts.wt. photosensitizer being a bisazide compound to obtain a photosensitive resin composition.


Inventors:
Osamu Kiyohara
Tomohiro Taruishi
Application Number:
JP9116097A
Publication Date:
June 16, 2003
Filing Date:
April 09, 1997
Export Citation:
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Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
G03F7/027; C08F299/02; C08G69/48; C08L77/10; C09D177/06; G03F7/037; G03F7/038; (IPC1-7): C08G69/48; C08F299/02; C08L77/10; G03F7/037
Domestic Patent References:
JP7207020A
JP782374A
Attorney, Agent or Firm:
Masatake Shiga (2 outside)