Title:
PHOTOSENSITIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME
Document Type and Number:
Japanese Patent JP2003345012
Kind Code:
A
Abstract:
To form a pattern with high resolution, high sensitivity and good dimensional accuracy.
A photosensitive composition is provided which comprises (A) a compound having an addition-polymerizable group or a polymer having an addition-polymerizable group and (B) a photo-radical polymerization initiator represented by formula (1).
Inventors:
MIYASAKA MASAHIRO
KAJI MAKOTO
KAJI MAKOTO
Application Number:
JP2002153608A
Publication Date:
December 03, 2003
Filing Date:
May 28, 2002
Export Citation:
Assignee:
HITACHI CHEM DUPONT MICROSYS
International Classes:
G03F7/031; C07C323/47; C08F2/50; C08F290/14; G03F7/038; H01L21/027; (IPC1-7): G03F7/031; C08F2/50; C08F290/14; G03F7/038; H01L21/027
Attorney, Agent or Firm:
Yukihiko Takada