To obtain a photosensitive element having a photosensitive insulating resin layer formed by a laminating system and capable of improving adhesion to a metallic plating film without causing problem on safety and environment and to produce a multilayered circuit board using the element.

An aq. resin layer contg. fine particles of at least one kind of material having 1-10μm average particle diameter or average aggregation diameter is formed on a temporary substrate and a photosensitive insulating resin layer is formed on the aq. resin layer to obtain the objective photosensitive element. This element is disposed by press laminating under heating on an insulating substrate with a formed circuit pattern. After exposure, bias holes are pierced by development, post-exposure and post-baking are carried out and then electroless plating, electroplating and layer-to-layer connection are carried out. A circuit as a 2nd layer is further formed.