Title:
感光性樹脂組成物
Document Type and Number:
Japanese Patent JP7295299
Kind Code:
B2
Abstract:
To provide: a photosensitive resin composition which can give a photocured product having excellent film-sticking-prevention properties and bending properties without impairing basic characteristics of insulation reliability and heat resistance; and a wiring board having a photocured film of the photosensitive resin composition.SOLUTION: This photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a reactive diluent, (D) an epoxy compound, (E) urethane beads, and (F) a fine powdery inorganic filler.SELECTED DRAWING: None
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Inventors:
Sadao Miki
Mari Okada
Hiroki Yamamoto
Mari Okada
Hiroki Yamamoto
Application Number:
JP2022041839A
Publication Date:
June 20, 2023
Filing Date:
March 16, 2022
Export Citation:
Assignee:
Tamura Manufacturing Co., Ltd.
International Classes:
G03F7/004; G03F7/035; H05K3/28
Domestic Patent References:
JP2017201369A | ||||
JP2002293882A | ||||
JP2013205624A | ||||
JP2015121775A | ||||
JP2019056824A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Ueshima class
Shuichi Sumiyoshi
Junichi Maekawa
Ueshima class
Shuichi Sumiyoshi
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