平面コイル基板 - Sumitomo Electric Print Circuit Co., Ltd.

Title:

平面コイル基板

Document Type and Number:

Japanese Patent JP7255784

Kind Code:

B2

Abstract:

To provide a planar coil substrate capable of improving reliability of a connection between wires.SOLUTION: A planar coil substrate 1 comprises one or more insulation layers 2 and (n) conductive layers 3 and 4 including multi-annular wiring patterns 3a and 4a, and the insulation layer and the conductive layer are alternately laminated. Each of a plurality of wires constituting the multi-annular wiring pattern is cut in a portion and includes a plurality of through holes 5 connecting an end of a k-th layer at one side in a winding direction of the wire with an end of any other layer than the k-th layer at the other side in a winding direction of the wire. An outermost wire 11e of the multi-annular wiring pattern of a first layer is divided into two division pieces 13a and 13b connected to a pair of terminals X and Y. The multi-annular wiring patterns of the plurality of conductive layers and the plurality of through holes constitute a spiral closed loop including a first loop which moves from one of the pair of terminals to the center in a planar view and a second loop which moves from the center to the other terminal.SELECTED DRAWING: Figure 1

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Inventors:

Masahiko Takachi

Application Number:

JP2019177103A

Publication Date:

April 11, 2023

Filing Date:

September 27, 2019

Export Citation:

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