To provide a polishing composition which polishes a polishing object at high polishing speed and more efficiently removes remained abrasive grains adhered to the polishing object after polishing by washing.
In the abrasive grains contained in the polishing composition, when the zeta potential of the abrasive grains at polishing is defined as X1[mV] and the zeta potential of the polishing object at polishing is defined as Y1[mV], the relationship of X1XY1≤0 is satisfied. Further, when the zeta potential of the abrasive grains at washing is defined as X2[mV] and the zeta potential of the polishing object at washing is defined as Y2[mV], the relationship of X2XY2>0 is selected to be satisfied. The abrasive grains preferably consists of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The polishing object preferably consists of a nickel-containing alloy, silicon oxide, or aluminum oxide.
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TAMAI KAZUMASA
ASANO HIROSHI
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Makoto Onda
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