To restrain generation of hydroplaning phenomenon and prevent a workpiece from being separated from a carrier to thereby surely polish the same by properly controlling the supply quantity of polishing material slurry in polishing the same with a flat surface polishing device.
A workpiece W is held by a carrier 15 rotating while revolving around a sun gear 11, the workpiece W is held from both sides thereof between upper and lower surface plates 13, 14 capable of rotating, the rotational speed and work load of the plates 13, 14 are controlled to plural steps while supplying polishing material slurry to between the plates 13, 14, and the work W is polished. In this case, during the time when the rotational speed and/or work load of the plates 13, 14 are small at the initial stage of work, the supply quantity of slurry made by a pump 33 is restrained to a lower level than that at the time of normal work, and is increased according to the increase of the rotational speed and/or the work load.
NAGAI MANABU
NAKAJO YOSHIHIRO
