POLYAMIDE COMPOSITION FOR COATING

Title:

POLYAMIDE COMPOSITION FOR COATING

Document Type and Number:

Japanese Patent JP3385774

Kind Code:

B2

Abstract:

PURPOSE: To obtain a polyamide resin composition having high adhesion to a coating film by compounding a polyamide resin with a dimer acid/ polyalkylenepolyamine polyamide and an inorganic filler in a specific proportion.
CONSTITUTION: This composition comprises 100 pts.wt. polyamide resin (1), 0.3-20 pts.wt. dimer acid/polyalkylenepolyamine polyamide (2), and 0-100 pts.wt. inorganic filler (3). Examples of the resin (1) include nylon 6, nylon 11, nylon 12, nylon 66, nylon 610, and nylon 612. An example of the polymer (2) is formed from a dimer acid and at least one polyalkylamine selected among diethylenetriamine, triethylenetetramine, etc. Examples of the filler (3) include calcium carbonate, calcium silicate, talc, kaolin, and mica.

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Inventors:

Kazuhiko Takasugi
Michiyuki Imai
Yoshifumi Akagawa

Application Number:

JP2966495A

Publication Date:

March 10, 2003

Filing Date:

February 17, 1995

Export Citation:

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Assignee:

Ube Industries,Ltd.

International Classes:

B05D7/24; C08J7/04; C08K3/00; C08K7/02; C08L77/00; C09D177/00; (IPC1-7): C09D177/00

Domestic Patent References:

JP63125572A

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