To provide a new polyamide having excellent heat resistance, chemical resistance and low water absorption in comparison with those of conventional polyamide films, and to provide a polyamide film comprising the same.

This polyamide comprises dicarboxylic acid units containing terephthalic acid units in an amount of 60-100 mol.% and diamine units containing 9-12C aliphatic alkylenediamine units in an amount of 60-100 mol.%, has an intrinsic viscosity of 0.8-2.0 dl/g measured in concentrated sulfuric acid at 30°C, a difference (Tch-Tg) of ≥20°C between the cold crystallization temperature (Tch) and the glass transition temperature (Tg) of a quickly cooled sample obtained by quenching the melted polyamide in ice water, and further has a density of <1.16.