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Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREFROM
Document Type and Number:
Japanese Patent JP2008133429
Kind Code:
A
Abstract:

To provide a polyamide resin composition being balanced between mold transcription properties, mechanical characteristics such as rigidity and good flowability in a high level.

The polyamide resin composition comprises 100 pts.wt. of a polyamide resin (a), 10-200 pts.wt. of a fibrous inorganic filler (b) and 0.01-30 pts.wt. of a resinous polyester resin (c) comprising at least one species structural unit selected from aromatic oxycarbonyl units (S), aromatic and/or aliphatic dioxy units (T) and aromatic dicarboxy units (U), and 3-functional organic residues (D) whose content is in the range of 7.5-50 mol% based on the entire monomers constituting the resinous polyester.


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Inventors:
HAMAGUCHI MITSUSHIGE
YOKOE MAKIHITO
Application Number:
JP2007195747A
Publication Date:
June 12, 2008
Filing Date:
July 27, 2007
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08K7/04
Domestic Patent References:
JP2001118277A2001-04-27
JPH04227657A1992-08-17
JP2000248173A2000-09-12
JP2004099845A2004-04-02
JP2001118277A2001-04-27
Foreign References:
WO2006042705A12006-04-27
WO2006042705A12006-04-27