Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREFROM
Document Type and Number:
Japanese Patent JP2008133429
Kind Code:
A
Abstract:
To provide a polyamide resin composition being balanced between mold transcription properties, mechanical characteristics such as rigidity and good flowability in a high level.
The polyamide resin composition comprises 100 pts.wt. of a polyamide resin (a), 10-200 pts.wt. of a fibrous inorganic filler (b) and 0.01-30 pts.wt. of a resinous polyester resin (c) comprising at least one species structural unit selected from aromatic oxycarbonyl units (S), aromatic and/or aliphatic dioxy units (T) and aromatic dicarboxy units (U), and 3-functional organic residues (D) whose content is in the range of 7.5-50 mol% based on the entire monomers constituting the resinous polyester.
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Inventors:
HAMAGUCHI MITSUSHIGE
YOKOE MAKIHITO
YOKOE MAKIHITO
Application Number:
JP2007195747A
Publication Date:
June 12, 2008
Filing Date:
July 27, 2007
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08K7/04
Domestic Patent References:
JP2001118277A | 2001-04-27 | |||
JPH04227657A | 1992-08-17 | |||
JP2000248173A | 2000-09-12 | |||
JP2004099845A | 2004-04-02 | |||
JP2001118277A | 2001-04-27 |
Foreign References:
WO2006042705A1 | 2006-04-27 | |||
WO2006042705A1 | 2006-04-27 |
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