Title:
POLYIMIDE RESIN COMPOSITION AND GLUE FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2017057340
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a thermal conductive glue film having excellent adhesiveness, high thermal conductivity and good electrical insulation properties by dispersing an inorganic filler having specific particle diameter at a certain ratio.SOLUTION: There is provided the resin composition that contains a phenolic hydroxyl group-containing aromatic polyimide resin (A) having a specific structure, an epoxy resin (B) and a thermal conductive inorganic filler (C). In the resin composition, content of the inorganic filler C) in the resin composition is 45 to 64 vol.% at 25°C and the inorganic filler (C) contains an aggregate (c1) consisting of boron nitride and having an average particle diameter (D50) of 50 to 100 μm, alumina (c2) having an average particle diameter (D50) of 30 to 50 μm, alumina (c3) having an average particle diameter (D50) of 1 to 10 μm and one or two or more kind of inorganic filler (c4) selected from a group consisting of boron nitride, alumina and aluminum nitride each having an average particle diameter (D50) of 0.1 to 3 μm.SELECTED DRAWING: None
More Like This:
Inventors:
KAMI NAOMI
NAGASHIMA NORIYUKI
ISHIKAWA KAZUNORI
IWASAKI KOKI
HAYASHIMOTO SHIGEO
NAGASHIMA NORIYUKI
ISHIKAWA KAZUNORI
IWASAKI KOKI
HAYASHIMOTO SHIGEO
Application Number:
JP2015185177A
Publication Date:
March 23, 2017
Filing Date:
September 18, 2015
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08L79/08; B32B15/088; C08G73/10; C08K3/22; C08K3/38; C08L63/00; C09J7/00; C09J7/02; C09J11/04; C09J163/00; C09J179/08
Domestic Patent References:
| JP2015108139A | 2015-06-11 | |||
| JP2014193965A | 2014-10-09 | |||
| JP2014156531A | 2014-08-28 | |||
| JP2008510878A | 2008-04-10 |
Foreign References:
| WO2015059950A1 | 2015-04-30 | |||
| WO2012132691A1 | 2012-10-04 | |||
| WO2012046814A1 | 2012-04-12 |