Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM USING THE SAME, AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015200819
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can provide a cured film realizing inhibited warpage, little residual stress and excellent physical properties with a curing temperature of 300°C or less; a patterned cured film using the same; and a production method thereof.SOLUTION: A positive photosensitive resin composition comprises (A) at least one polymer selected from the group consisting of polyimide, polybenzoxazole and precursors thereof, (B) a compound that generates an acid upon irradiation with light, (C) a thermal crosslinking agent, and (D) an acrylic resin including a structure represented by the general formula (1). (In the general formula (1), Rrepresents hydrogen or a methyl group; and Rrepresents a hydrogen atom, a hydroxyl group, a C1-12 alkyl group, alkoxyl group, or a carboxyl group.)
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Inventors:
TANIMOTO AKITOSHI
ONO TAKASHI
YAMASHITA YUKIHIKO
AOKI MASARU
ONO TAKASHI
YAMASHITA YUKIHIKO
AOKI MASARU
Application Number:
JP2014080162A
Publication Date:
November 12, 2015
Filing Date:
April 09, 2014
Export Citation:
Assignee:
HITACHI CHEM DUPONT MICROSYS
International Classes:
G03F7/023; G03F7/004; G03F7/40; H01L21/027
Attorney, Agent or Firm:
Kazuyasu Minagawa
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