To provide a power module substrate, a power module substrate with a heat sink, a power module and a power module substrate manufacturing method, which can radiate heat from an electronic component and the like mounted on a circuit layer and inhibit an occurrence of cracks in an insulation substrate under a cooling/heating cycle load.
A power module substrate 10 comprises an insulation substrate 11 and a circuit layer 12 formed on one surface of the insulation substrate 11. The circuit layer 12 is composed of a copper plate bonded to the one surface of the insulation substrate 11. The copper plate has a composition of containing, before being bonded, either one of at least one element of a total amount of not less than 1 molppm to not more than 100 molppm among an alkaline earth element, a transition metal element and a rare earth element, or boron of not less than 100 molppm to not more than 1000 molppm, in which the balance is copper and incidental impurities.
NAGATOMO YOSHIYUKI
TERASAKI NOBUYUKI
SAKAMOTO TOSHIO
MAKI KAZUMASA
MORI HIROYUKI
ARAI ISAO
| JPH0360185A | 1991-03-15 | |||
| JPH05170564A | 1993-07-09 |
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa
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