PREPREG USING ORGANIC FIBER BASE MATERIAL AND MANUFACTURING METHOD OF THE SAME, AND LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND WIRING BOARD USING THE PREPREG

Japanese Patent JP2014012759

A

To provide a prepreg expressing low thermal expansion and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.

A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% in an organic fiber base material. In general formula (I), each R₁ is independently an alkylene group having 1-5 carbon atoms or an alkyleneoxy group; each Ar₁ is independently a single bond, an arylene group, or an alkylene group having 1-5 carbon atoms; and m is an integer of 5-100.

JP6394941	Epoxy compounds, phenolic hydroxyl group-containing compounds, curable compositions, cured products thereof, semiconductor encapsulant materials, semiconductor devices, prepregs, circuit boards, build-up films, build-up boards, fiber-reinforced composite materials, and fiber-reinforced resin molded products.
JP2010126627	PREPREG AND LAYERED PRODUCT USING IT
JP6267140	Resin composition

TAKAHARA NAOKI
OZE MASAHISA
SAKAI KAZUNAGA
MORITA KOJI
IZUMI HIROYUKI
ISHIKURA KUMIKO

JP2012150385A

January 23, 2014

July 04, 2012

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HITACHI CHEMICAL CO LTD

C08J5/24; B32B5/28; H05K1/03

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