Title:
PRINTED WIRING BOARD MOUNTING FIXTURE, AND PRINTED WIRING BOARD MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2005086062
Kind Code:
A
Abstract:
To provide a printed wiring board mounting fixture high in heat resistance and not allowing a volatile compound to occur to induce contact troubles or adhesion troubles during a printed wiring board mounting process, and to provide a printed wiring board mounting method using the fixture.
The printed wiring board mounting fixture has a supporting layer and an adhesive layer which is laminated on the supporting layer, and the adhesive layer contains a fluororubber.
Inventors:
FUJITA NAOSHI
NAKAJIMA TAKASHI
NAKAJIMA TAKASHI
Application Number:
JP2003317985A
Publication Date:
March 31, 2005
Filing Date:
September 10, 2003
Export Citation:
Assignee:
INOUE MTP KK
INOAC GIJUTSU KENKYUSHO KK
INOAC GIJUTSU KENKYUSHO KK
International Classes:
C09J127/12; C09J127/14; C09J127/16; C09J127/18; C09J127/20; H05K3/34; (IPC1-7): H05K3/34; C09J127/12; C09J127/14; C09J127/16; C09J127/18; C09J127/20
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Fumio Shinoda
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