Title:
PRODUCTION OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH05175388
Kind Code:
A
Abstract:
PURPOSE: To improve productivity, shorten the manufacturing time and reduce the cost without disturbing the promotion of increase of pins.
CONSTITUTION: A carriage reference hole 3 and an inner lead 4 are formed by etching, an outer frame and an outer lead 5 are formed by pressing and resist 2 for etching is formed by lamination of a dry film.
Inventors:
SUZUKI KATSUMI
SATO MANABU
SATO MANABU
Application Number:
JP35577391A
Publication Date:
July 13, 1993
Filing Date:
December 21, 1991
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
C23F1/00; G03F7/20; H01L23/50; (IPC1-7): C23F1/00; G03F7/20; H01L23/50
Attorney, Agent or Firm:
Tadao Hirata (2 outside)