PURPOSE: To allow the repeated use of an original plate without damaging a pattern on the original plate, improve a molding accuracy, and obtain a higer quality by a method wherein an approximately flat original plate obtained by forming recessed parts in a conductive substrate and providing a non- conductive film only in the recessed parts is used for electroforming.

CONSTITUTION: A photoresist 22 is applied to a conductive substrate 20 and formed into a resist pattern 23. The substrate is etched by a wet etching method. Succeedingly, the resist pattern is removed by an organic solvent. Then, irregularities similar to the resist pattern 23 are formed on the surface of the conductive substrate 20. Thereon, sol gel liquid is applied and burned, whereby an SiO2 film is formed as a non-conductive film 24. After that, the SiO2 film is etched by a dry etching method until the surface of the conductive substrate 20 per se is exposed. In this manner, an original plate 26 having a substantially flat surface is obtained. The use of this original plate 26 as an electroforming original plate ensures a higher molding accuracy resulting in a higher quality.