PUNCHED CHIP SEPARATING DEVICE

Japanese Patent JP3764028

B2

PROBLEM TO BE SOLVED: To provide a punched chip separating device capable of executing a process for separating the punched chips corresponding to a number of punched holes and punched holes formed in adjacent to each other. SOLUTION: Plural long projecting members 5 respectively having operation pins 8 axially advanceably and retractably projected and energized by the thrust are formed in a blocked state on a punched chip separation-type base 2 having a desired size and mounted on a machine body.