Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2016057415
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in LWR performance, resolution, rectangularity in a cross-sectional shape, depth of focus and resist film shrinkage suppressing property.SOLUTION: The radiation-sensitive resin composition comprises a polymer having a first structural unit represented by formula (1), a radiation-sensitive acid generator, and a solvent. In formula (1), Xand Xeach independently represent -O- or -NR'-; Rrepresents a monovalent organic group having 1 to 20 carbon atoms; Z represents a substituted or unsubstituted phenylene group, a substituted or unsubstituted naphthylene group, or -CO-; and Rrepresents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms.SELECTED DRAWING: None
Inventors:
NAMAI HAYATO
Application Number:
JP2014182795A
Publication Date:
April 21, 2016
Filing Date:
September 08, 2014
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/039; C08F16/00; C08F20/10; C08F20/54; C08F26/02; G03F7/038; H01L21/027
Domestic Patent References:
JP2010077440A | 2010-04-08 | |||
JP2014153440A | 2014-08-25 | |||
JPH0337214A | 1991-02-18 | |||
JP2004269412A | 2004-09-30 |
Foreign References:
WO2010084497A1 | 2010-07-29 | |||
US20130011783A1 | 2013-01-10 |
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka
Previous Patent: Radiation-sensitive resin composition
Next Patent: Radiation-sensitive resin composition
Next Patent: Radiation-sensitive resin composition