REINFORCING MEMBER, REINFORCING STRUCTURE FOR IC CHIP MOUNTING PART AND ASSEMBLY METHOD FOR IC CARD AND REINFORCING MEMBER

Japanese Patent JP3918336

B2

PROBLEM TO BE SOLVED: To provide a reinforcing structure for expelling residual air to be the cause of weakening a reinforcing effect in the reinforcing structure of an IC chip mounting part to the utmost.
SOLUTION: A groove part 11 provided in this reinforcing member 10 is oppositely arranged on the side of reinforcing resin 7. When the reinforcing member has no groove part 11 and has a smooth surface, in the case that a gap 20 is generated between the reinforcing member 10 and the reinforcing resin 7, when the gap 20 is not communicated with the outside at all, even though pressurizing is performed and the residual air is forced to be expelled to the outside, the reinforcing resin 7 of high viscosity hardly flows and the residual air is present. To the contrary, when the reinforcing member 10 is provided with the groove part 11, even when the reinforcing member 10 and the reinforcing resin 7 are tightly adhered at the part other than the groove part 11, the gap 20 is communicated with the outside at the groove part 11. Thus, even the reinforcing resin 7 of the high viscosity relatively easily flows, the residual air inside the gap 20 expelled through the groove part 11 to the outside and the possibility of eliminating the residual air becomes high as a result.

Kenji Kamiya
Masahiro Sugiura
Kiyoshi Nakakugi
Jun Saito

JP36991498A

May 23, 2007

December 25, 1998

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株式会社デンソー

G06K19/077; (IPC1-7): G06K19/077

JP9263082A
JP2033443U
JP6042231U
JP62142695A

Tsutomu Adachi

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