Title:
RESIN COMPOSITION FOR ENCAPSULATION, RELOCATED WAFER, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2023160920
Kind Code:
A
Abstract:
To provide: a resin composition for encapsulation in which poor appearance on a surface of an encapsulating material after molding is suppressed while suppressing warpage of a support body after encapsulation; a relocated wafer and a semiconductor package obtained by using the same; and a manufacturing method of the semiconductor package in which warpage of the support body after encapsulation is suppressed and an appearance of the surface of the encapsulation material after molding is good.SOLUTION: The resin composition for encapsulation comprises a curable resin composition, an elastomer component, a coupling agent, and a filler, in which a content of the elastomer component is 1.0 mass% to 8.0 mass%. The resin composition satisfies at least one selected from a condition 1 and a condition 2, wherein the condition 1 is that a heating weight loss rate when the elastomer component is left in an environment of 150°C for one hour is 1.1 mass% or less, and the condition 2 is that a content of the coupling agent is 0.75 mass% or less of the total.SELECTED DRAWING: None
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Inventors:
NAMIKI YUJI
MATSUNO TATSUYA
IKEUCHI TAKATOSHI
MATSUNO TATSUYA
IKEUCHI TAKATOSHI
Application Number:
JP2023143115A
Publication Date:
November 02, 2023
Filing Date:
September 04, 2023
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
C08L63/00; C08G59/18; C08K3/013; C08K5/541; C08L45/00; C08L83/04; H01L23/12; H01L23/29
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office