Title:
RESIN COMPOSITION FOR IMPREGNATION, PREPREG AND LAMINATE
Document Type and Number:
Japanese Patent JPH02227416
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition providing prepreg having excellent workability and laminate having excellent thickness and accuracy of plate, having flexibility free from tack, comprising an epoxy resin, latent curing agent, polymerizable unsaturated group-containing resin, polymerization initiator and an organic solvent. CONSTITUTION:The aimed composition at least comprising (A) an epoxy resin (e.g. epoxy resin obtained from epichlorohydrin, etc., and bisphenol, etc.), (B) a latent curing agent (preferably causing curing reaction when heated to >=120 deg.C, e.g. dicyandiamide), (C) a polymerizable unsaturated group-containing resin (preferably epoxyvinyl ester resin or unsaturated polyester resin), (D) a polymerization initiator (e.g. cyclohexanone peroxide) and (E) an organic solvent (e.g. acetone).
Inventors:
OTAKE RIICHI
HAYASHI MUNEKAZU
DEMURA SATOSHI
HAYASHI MUNEKAZU
DEMURA SATOSHI
Application Number:
JP4547089A
Publication Date:
September 10, 1990
Filing Date:
February 28, 1989
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
B32B15/08; B29C43/30; C08G59/18; C08G59/40; C08J5/24; B29K63/00; B29K105/06; H05K1/03; (IPC1-7): B29C43/30; B29K63/00; B29K105/06; B32B15/08; C08G59/18; C08J5/24
Attorney, Agent or Firm:
Tadashi Sano